The effect of surface roughness and nonuniform metal thickness on the etching of sputter‐deposited copper and chromium
作者:
S. N. Ganguli,
D. Berk,
期刊:
Journal of Vacuum Science&Technology A: Vacuum, Surfaces, and Films
(AIP Available online 1988)
卷期:
Volume 6,
issue 6
页码: 3068-3073
ISSN:0734-2101
年代: 1988
DOI:10.1116/1.575476
出版商: American Vacuum Society
关键词: ROUGHNESS;COPPER;CHROMIUM;ETCHING;SPUTTERING;VAPOR DEPOSITED COATINGS;THIN FILMS;LAYERS;THICKNESS;POTASSIUM COMPOUNDS;SODIUM HYDROXIDES;MANGANESE OXIDES;Cu;Cr
数据来源: AIP
摘要:
Variations in metal thickness and surface roughness of sputter‐deposited Cr/Cu/Cr metals on aluminum ceramics and glass slides were measured. The copper layer, which has a thickness of 75 kÅ, shows the most uniform surface, while the base chrome layer with an average thickness of 750 Å shows the least. Etch rates were determined as a function of surface roughness for chromium using a KMnO4/NaOH etchant and for copper using a FeCl3etchant. The results for both metals show that the rate increases 2–3 times when the surface roughness is increased.
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