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Identification and elimination of chlorofluorocarbon pump fluid contamination in a plasma etch system

 

作者: Eric R. Sirkin,   R. D. Powell,  

 

期刊: Journal of Vacuum Science&Technology B: Microelectronics Processing and Phenomena  （AIP Available online 1983）
卷期: Volume 1, issue 1  

页码: 74-76

 

ISSN:0734-211X

 

年代: 1983

 

DOI:10.1116/1.582508

 

出版商: American Vacuum Society

 

关键词: plasma;pumps;etching;contamination;nitrogen;organic fluorine compounds;chlorinated aliphatic hydrocarbons;abundance;quantity ratio;gas analysis;impurities

 

数据来源: AIP

 

摘要:

Residual gas analysis is used to identify chlorofluorocarbon‐based contamination in the process chamber of a roots‐blower‐evacuated plasma etch system. The contamination is shown to result from volume migration of the corrosion resistant fluid used in a rotary vane backing pump. Injection of a regulated N2flow between the blower and backing pump effectively eliminates the contamination.

 

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