Effect of bumps on the wafer on ion distribution functions in high-density argon and argon-chlorine discharges
作者:
J. R. Woodworth,
B. P. Aragon,
T. W. Hamilton,
期刊:
Applied Physics Letters
(AIP Available online 1997)
卷期:
Volume 70,
issue 15
页码: 1947-1949
ISSN:0003-6951
年代: 1997
DOI:10.1063/1.118814
出版商: AIP
数据来源: AIP
摘要:
The presence of bumps on or near the wafer in plasma processing reactors can significantly affect plasma parameters. We have used a gridded energy analyzer to measure ion fluxes, energy distributions, and angular distributions near such bumps on a grounded electrode in an inductively coupled discharge in a Gaseous Electronics Conference Reference Cell. We find that the bumps affect the ion energy distributions only slightly, lower the ion fluxes by more than a factor of 2 and dramatically alter the ion angular distributions. ©1997 American Institute of Physics.
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