Thin‐film machining by laser‐induced explosion
作者:
Vicent J. Zaleckas,
Jackson C. Koo,
期刊:
Applied Physics Letters
(AIP Available online 1977)
卷期:
Volume 31,
issue 9
页码: 615-617
ISSN:0003-6951
年代: 1977
DOI:10.1063/1.89801
出版商: AIP
数据来源: AIP
摘要:
This paper describes a process for the laser machining of thin metallic films on dielectric substrates. The observation of a distinct minimum in the machining threshold and the fact that no substrate damage occurs over a wide range of incident power are explained based on an explosive film‐removal mechanism. Experimental results supporting the predictions are presented.
点击下载:
PDF
(206KB)
返 回