Noncontact sheet resistance measurement technique for wafer inspection
作者:
Krzysztof Kempa,
J. Martin Rommel,
Roman Litovsky,
Peter Becla,
Bohumil Lojek,
Frank Bryson,
Julian Blake,
期刊:
Review of Scientific Instruments
(AIP Available online 1995)
卷期:
Volume 66,
issue 12
页码: 5577-5581
ISSN:0034-6748
年代: 1995
DOI:10.1063/1.1146474
出版商: AIP
数据来源: AIP
摘要:
A new technique, MICROTHERM, has been developed for noncontact sheet resistance measurements of semiconductor wafers. It is based on the application of microwave energy to the wafer, and simultaneous detection of the infrared radiation resulting from ohmic heating. The pattern of the emitted radiation corresponds to the sheet resistance distribution across the wafer. This method is nondestructive, noncontact, and allows for measurements of very small areas (several square microns) of the wafer. ©1995 American Institute of Physics.
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