A study has been made of the structure and the dc electrical properties of a metal‐glass thick‐film system. The metal part is formed by thermal decomposition of an organometallic solution and consists of Au and Rh. The glass component is a lead boroaluminosilicate. The influence of the firing treatment, of the composition of the metal part, and of the metal‐to‐glass ratio on the structure and the electrical properties of the film has been investigated. Some glasses, derived from the original glass component, have been used. In this system it is possible to have very small temperature coefficients of resistance in a wide temperature range. Sheet resistances can vary by several orders of magnitude. Under certain conditions the conduction behaves anomalously below 186 K. The different types of conduction in this thick‐film system are correlated with the different structures.