A multi-layer thick film interconnection system
作者:
K.C.Bingham,
Y.Gurler,
期刊:
Radio and Electronic Engineer
(IET Available online 1968)
卷期:
Volume 36,
issue 6
页码: 367-372
年代: 1968
DOI:10.1049/ree.1968.0123
出版商: IERE
数据来源: IET
摘要:
The paper describes a multi-layer interconnection system suitable for 50–100 unencapsulated integrated circuit elements of the type used in high-speed computers. The power and earth planes with their associate dielectrics are made using the thick film technique. Methods of producing the conductor and dielectric films are discussed. Two additional conductor planes, forming the signal matrix in which the logic connections are made, are deposited by the thin film technique.
点击下载:
PDF
(3045KB)
返 回