A new bond graph model for conduction heat transfer is developed, and applied to thermal energy balance in the piezoelectric thickness vibrator. In formulation of the heat conduction model, the mechanical and electrical effects are included. Hence, it can be directly applied to the temperature-dependent thickness vibrator. For the purpose of evaluation of the new method, one-dimensional heat conduction excluding other variable effects is compared with the results of the analytic solutions in simple cases. The simulation illustrates the validity and the accuracy of the model. Although the model is applied to the one-dimensional case only, the method can be easily used for general heat conduction problems.