The cross‐sectional model (CSM) is an experiment designed to test the electrical and technological issues that are representative of a proposed Josephson Signal Processor. This paper describes the thin films aspects of the CSM. The existing Pb‐alloy technology for logic and memory circuits was developed further (for both chips and package parts) to meet the additional demands for the CSM. This included more extensive use of regulator junctions for on‐chip power distribution, more precise target value objectives for current levels on chip, and extension of the thin film technology to new package part structures, including additional thermal and mechanical processing. The vacuum depositions and materials, photolithography, package parts diagnostics, and chip diagnostic aspects of the CSM are described.