We describe a technique using photolithography to produce submicron‐scale thin‐film structures and simple multilevel structures by single‐mask lift‐off processing. The technique employs masks offset from the substrate and oblique angle thin‐film deposition. It provides a simple means of making small‐area Josephson junctions and varying‐thickness superconducting bridges and is suitable for the inclusion of these devices in circuits. The examples we show emphasize such applications in superconductivity; however, the technique may find uses in other fields as well.