SiO2planarization by two‐step rf bias‐sputtering
作者:
T. Mogami,
M. Morimoto,
H. Okabayashi,
E. Nagasawa,
期刊:
Journal of Vacuum Science&Technology B: Microelectronics Processing and Phenomena
(AIP Available online 1985)
卷期:
Volume 3,
issue 3
页码: 857-861
ISSN:0734-211X
年代: 1985
DOI:10.1116/1.583116
出版商: American Vacuum Society
关键词: SPUTTERING;SILICA;METALLIZATION;FABRICATION;VLSI;SURFACE STRUCTURE;PLANAR CONFIGURATION;ETCHING
数据来源: AIP
摘要:
A new angled‐surface‐moving model for surface planarization by rf bias sputtering is proposed. This planarization is achieved by angular selective etching of SiO2films on top of metal stripes. A two‐step rf bias‐sputtering technique was developed, based on the new model. In this technique, the substrate bias voltage was changed in two steps during bias sputtering. The first step was to fill gaps without microcracks. The second step was to planarize at higher substrate bias. The planarized SiO2layer surface, deposited on thermally oxidized Si wafers with Mo stripe patterns, had good flatness. A planarized 4‐level metallization test structure was fabricated by the two‐step rf bias‐sputtering.
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