The effects of thermal nitridation and reoxidation on the interfacial stress and structure of silicon dioxide gate dielectrics
作者:
J. T. Yount,
P. M. Lenahan,
P. W. Wyatt,
期刊:
Journal of Applied Physics
(AIP Available online 1995)
卷期:
Volume 77,
issue 2
页码: 699-705
ISSN:0021-8979
年代: 1995
DOI:10.1063/1.359057
出版商: AIP
数据来源: AIP
摘要:
Electron spin resonance spectroscopy is used to study the effects of thermal NH3nitridation and subsequent reoxidation on the structure of the dielectric/silicon interface. This is accomplished by study of thePbcenter, an interfacial point defect. The values ofg⊥inPbspectra observed in the nitrided oxide and reoxidized nitrided oxide systems differ from Si/SiO2systems, suggesting that the average value of the tensile stress in the silicon substrate increases upon nitridation while reoxidation acts to return the interfacial stress to prenitridation levels. The implications of these structural changes upon device performance are discussed. ©1995 American Institute of Physics.
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