Thermoelectric Power of Vacuum‐Evaporated Au&sngbnd;Ni Thin‐Film Thermocouples
作者:
D. D. Thornburg,
C. M. Wayman,
期刊:
Journal of Applied Physics
(AIP Available online 1969)
卷期:
Volume 40,
issue 7
页码: 3007-3013
ISSN:0021-8979
年代: 1969
DOI:10.1063/1.1658114
出版商: AIP
数据来源: AIP
摘要:
Continued investigations of the thermoelectric properties of Au&sngbnd;Ni thin‐film thermocouples have been made. The thickness dependence of the Seebeck coefficient for Ni films of variable thickness on bulk Au was determined and found to be sensitive to the thermal history of the thin film thermocouples. By developing suitable preparation techniques for these thermocouples, involving several periods of annealing, time‐invariant calibration curves were obtained. The thickness dependence of the Seebeck coefficient was found to follow closely the predictions of the size‐effect theory of Mayer.
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