Magnetic oxide platelets, useful for memory and logic circuits, are presently prepared by diamond abrasive polishing techniques. Processed platelets, however, usually contain thin damage layers and microscopic scratches resulting in increased domain wall coercivity. Platelets less than 1 mil in thickness and of desirable flatness are difficult to prepare using these techniques. Ion milling has been successfully used to rapidly remove abrasive and polishing induced defects and at the same time produce flat surfaces of much less than 1 mil in thickness. The measured removal rate was 0.5 &mgr;/h/side; however 500‐&mgr;/h/side rates are attainable. Final platelets are scratch free, flat, and highly reflecting, having lower domain wall coercivity than diamond polished plates. No change in mobility was observed following ion milling. The process is adaptable to large areas and a wide variety of related applications.