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Filling of micron‐sized contact holes with copper by energetic cluster impact

 

作者: Hellmut Haberland,   Martin Mall,   Michael Moseler,   You Qiang,   Thomas Reiners,   Yonca Thurner,  

 

期刊: Journal of Vacuum Science&Technology A: Vacuum, Surfaces, and Films  （AIP Available online 1994）
卷期: Volume 12, issue 5  

页码: 2925-2930

 

ISSN:0734-2101

 

年代: 1994

 

DOI:10.1116/1.578967

 

出版商: American Vacuum Society

 

关键词: COPPER;ATOMIC CLUSTERS;FILLER METALS;THIN FILMS;ENERGY BEAM DEPOSITION;CLUSTER BEAMS;ELECTRIC CONTACTS;INTEGRATED CIRCUITS;KEV RANGE 10−100;Cu;Mo

 

数据来源: AIP

 

摘要:

A completely ionized and clustered beam of Mo or Cu is deposited with variable kinetic energy on a substrate, and the filling of micron‐sized contact holes on semiconductor devices is studied. An excellent hole filling is obtained for the impact of charged copper clusters, if they contain 1000–3000 Cu atoms and impinge with a kinetic energy of about 10 eV per atom on a substrate having a temperature of 500 K. The morphology of small hole fillings by slow and energetic cluster impact is discussed.  

 

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