Nanostructured Ta-Si-N diffusion barriers for Cu metallization
作者:
Dong Joon Kim,
Yong Tae Kim,
Jong-Wan Park,
期刊:
Journal of Applied Physics
(AIP Available online 1997)
卷期:
Volume 82,
issue 10
页码: 4847-4851
ISSN:0021-8979
年代: 1997
DOI:10.1063/1.366346
出版商: AIP
数据来源: AIP
摘要:
Diffusion barrier properties of nanostructured amorphous Ta-Si-N thin films with different N concentrations have been investigated in metallurgical aspects of Cu metallization. When the N content exceeds 40 at. &percent;, the Ta-Si-N film remains in the nanostructure phase even after annealing at 1100 °C for 1 h and effectively prevents Cu diffusion after annealing at 900 °C for 30 min. The reason for the excellent thermal stability is that excess N atoms disturb the grain growth ofTaSi2phase and keep the Ta-Si-N film in the nanostructure phase during the high temperature annealing. The Ta-Si-N film with N content less than 40 at. &percent; fails to prevent the Cu diffusion after annealing at 700 °C for 30 min. ©1997 American Institute of Physics.
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