In general, the electron attachment rate constantka(⟨&egr;⟩,T), as a function of the mean electron energy ⟨&egr;⟩ and temperatureTfor electronegative gases which attach electronsnondissociativeily, decreases greatly withTfrom room temperature toT≲600 K, while theka(⟨&egr;⟩,T) of electronegative gases which attach electronsdissociativelyincreases with increasingT. Based on recent studies at our laboratory onka(⟨&egr;⟩,T), we investigated the variation withT(∼295–575 K) of the uniform field breakdown strength, (E/N)lim, for three classes of electronegative gases: (a) gases such asc‐C4F8(andc‐C4F6, 1−C3F6) which attach strongly low‐energy (≲1 eV) electrons nondissociatively and for whichka(⟨&egr;⟩,T) decreases precipitously withTabove ambient: (b) gases such as C2F6and CF3Cl which attach electrons exclusively dissociatively and whoseka(⟨&egr;⟩,T) increases withT; and (c) gases such as C3F8andn‐C4F10which attach electrons both nondissociatively and dissociatively over a common low‐energy range and whoseka(⟨&egr;⟩,T) first decreases and then increases withTabove ambient. The (E/N)lim(T) has been found todecreasesignificantly withTfor (a), todecreaseslowly withTfor (c), and toincreaseslightly withTfor (b). These changes in (E/N)limfollow those inka(⟨&egr;⟩,T). A similar behavior is expected for other electronegative gaseous dielectrics in the respective three groups.