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Interface compound formation and dependence on In‐layer thickness in Ni/In thin‐film systems

 

作者: R. Platzer,   U. Wo¨hrmann,   X. L. Ding,   R. Fink,   G. Krausch,   B. Luckscheiter,   J. Voigt,   G. Schatz,  

 

期刊: Applied Physics Letters  (AIP Available online 1991)
卷期: Volume 58, issue 25  

页码: 2904-2906

 

ISSN:0003-6951

 

年代: 1991

 

DOI:10.1063/1.104717

 

出版商: AIP

 

数据来源: AIP

 

摘要:

Interdiffusion and interface compound formation has been observed at the system Ni/In by using thin‐film couples as well as thin In films on low index Ni single‐crystal substrates. The method applied was the perturbed &ggr;&ggr;‐angular correlation technique, which is very sensitive to local structures and their changes around probe atoms. The successive occurrence of different Ni/In compounds could be observed on isochronal annealing above 230 K. A correlation between the appearance of compounds and In film thickness has been found.

 

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