Applications of computational fluid dynamics for improved performance in chemical‐vapor‐deposition reactors
作者:
David E. Kotecki,
Richard A. Conti,
Steven G. Barbee,
Theodore D. Cacouris,
Jonathan D. Chapple‐Sokol,
Rudolph J. Eschbach,
Donald L. Wilson,
Justin Wong,
Steven P. Zuhoski,
期刊:
Journal of Vacuum Science&Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
(AIP Available online 1994)
卷期:
Volume 12,
issue 4
页码: 2752-2757
ISSN:1071-1023
年代: 1994
DOI:10.1116/1.587187
出版商: American Vacuum Society
关键词: CVD;COMPUTERIZED SIMULATION;FLUID MECHANICS;MASS TRANSFER;HEAT TRANSFER;TWO−DIMENSIONAL CALCULATIONS;PERFORMANCE
数据来源: AIP
摘要:
Engineering models, based on computational fluid dynamics, have been developed and used to improve the performance of two metalorganic chemical‐vapor‐deposition reactors. Though the knowledge of the chemical reactions occurring during film deposition is incomplete, the models provide insight into the reactor’s performance and are useful in guiding reactor modifications. In one reactor, the effect of three gas injector designs on the film thickness uniformity is examined; in a second reactor, the shape and placement of a flow deflector, which redistributes the flow of gas over the wafer surface, is studied. In both cases, comparing the experimental results obtained both before and after the reactor modifications, significant improvements in film thickness uniformity were realized.
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