Sol-gel derived lead zirconate titanate (PZT) thin films were deposited onto monolithic Pt bottom electrodes which used Ti interlayers for Pt adhesion on thermally oxidized ⟨111⟩ Si. The rf-sputter deposited Pt/Ti films were annealed at 400° – 600°C for 15 minutes. Atomic Force Microscopy (AFM) was used to analyze the Pt surface features. Transmission Electron Microscopy (TEM), transmission electron diffraction, scanning transmission electron microscopy (STEM), and scanning electron microscopy (SEM) were used to investigate the microstructure of PZT films crystallized onto these electrodes. RT-66A testing was conducted to evaluate the electrode performance of the Pt/PZT/Pt structure devices. It was found that the lower temperature bottom electrode anneal created a more dense, smaller grained nucleated PZT film.