Amorphous Si0.56G0.44films were deposited on (001)Si by electron beam evaporation in a vacuum having a base pressure of 10−7Torr. They were then wet oxidized at 800 and 900 °C in an open tube furnace for various times. Cross (x)‐sectional and plan view transmission electron microscope techniques were employed to characterize the samples. At 800 °C, 30 min of wet oxidation produced a continuous polycrystalline Si‐Ge layer, whereas 60 min of wet oxidation produced a discontinuous polycrystalline layer. After 100 min of wet oxidation at 800 °C, the Si‐Ge layer was almost completely oxidized and no observable evidence of the epitaxial Si‐Ge layer was found. Wet oxidation at 900 °C for 10 min produced a bilayer structure; one epitaxial and one polycrystalline layer separated by a contamination layer initially present on the substrate prior to deposition. A mostly epitaxial Si‐Ge layer was obtained after 30 min of wet oxidation at 900 °C. These results will be discussed in terms of a previously suggested epitaxial growth model. The failure to obtain an observable epitaxial Si‐Ge layer by wet oxidation at 800 °C will be discussed by consideration of changes in the kinetics and the stability of both SiO2and GeO2at this temperature.