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Laser induced copper plating

 

作者: A. K. Al‐Sufi,   H. J. Eichler,   J. Salk,   H. J. Riedel,  

 

期刊: Journal of Applied Physics  （AIP Available online 1983）
卷期: Volume 54, issue 6  

页码: 3629-3631

 

ISSN:0021-8979

 

年代: 1983

 

DOI:10.1063/1.332404

 

出版商: AIP

 

数据来源: AIP

 

摘要:

Argon laser induced plating of copper spots and lines from copper sulfate solutions on glass and phenolic resin paper has been investigated. The substrates had to be precoated with an evaporated copper film. The highest plating rates have been obtained with a small film thickness of 25 nm. Spots with a thickness up to 30 &mgr;m were plated.

 

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