Arsenic ions have been implanted in (100)Si at an incident energy of 1 MeV to a dose of 1×1015/cm2. Rutherford backscattering measurements with a 1.5‐MeV He‐ion beam have shown that a buried amorphous layer is formed in the Si substrate which is implanted at a low ion‐beam current of 0.8 &mgr;A and that considerable annealing occurs when implantation is carried out at a high ion‐beam current of 2 &mgr;A. The implantation‐induced amorphous layer recrystallizes after annealing above 550 °C, but a high density of lattice defects still remains in the substrate even after annealing at 1000 °C. Defect observations using a cross‐sectional transmission electron microscope have revealed that those defects are located at the two depths corresponding to the initial transition regions where the crystallinity is changed from the amorphous to nonamorphized states in the substrate. In addition, secondary defects also exist in a particular region inside the initial buried amorphous layer. The recrystallization of the buried amorphous layer during post‐implant annealing is initiated not only from the deeper part of the substrate but also from the nonamorphized surface layer. From a series of isothermal annealing studies, it has been shown that the recrystallization rates at 550 °C are 140 and 180 A˚/min on the frontside and backside of the buried amorphous layer, respectively. Electrical profile measurements, using the differential Hall method, have shown that a highly doped, buried conductive layer with a peak carrier concentration of around 2×1019/cm3can be formed by annealing above 800 °C.