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Noncontact measurement of thermal conductivity of epoxy bonds by pulsed photothermal radiometry

 

作者: W. P. Leung,   A. C. Tam,  

 

期刊: Applied Physics Letters  (AIP Available online 1987)
卷期: Volume 51, issue 25  

页码: 2085-2087

 

ISSN:0003-6951

 

年代: 1987

 

DOI:10.1063/1.98955

 

出版商: AIP

 

数据来源: AIP

 

摘要:

Pulsed photothermal radiometry relies on the flash heating of a surface and the detection of the time dependence of the surface cooling by infrared radiometry. We show that this is useful as a nondestructive and noncontact technique to quantify the thermal conductivity of a subsurface epoxy bond underneath an opaque surface. The degree of curing of the epoxy can also be monitored.

 

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