Noncontact measurement of thermal conductivity of epoxy bonds by pulsed photothermal radiometry
作者:
W. P. Leung,
A. C. Tam,
期刊:
Applied Physics Letters
(AIP Available online 1987)
卷期:
Volume 51,
issue 25
页码: 2085-2087
ISSN:0003-6951
年代: 1987
DOI:10.1063/1.98955
出版商: AIP
数据来源: AIP
摘要:
Pulsed photothermal radiometry relies on the flash heating of a surface and the detection of the time dependence of the surface cooling by infrared radiometry. We show that this is useful as a nondestructive and noncontact technique to quantify the thermal conductivity of a subsurface epoxy bond underneath an opaque surface. The degree of curing of the epoxy can also be monitored.
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