Stress‐corrosion cracking—the phenomonon in which the initiation and propagation of cracks is enhanced by a chemically active environment—has previously not been observed in silicon. For example, extensive experiments have shown no effect of water on the fracture properties. However, using indentation cracks in the presence of a HF etch, we have been able to show stress‐corrosion cracking in silicon for the first time. This is attributed to the initial removal of the native silica layer, and the subsequent lowering of the fracture resistance by passivation of the crack surfaces.