Alignment and registration schemes for projection electron lithography
作者:
R. C. Farrow,
S. D. Berger,
J. M. Gibson,
J. A. Liddle,
J. S. Kraus,
R. M. Camarda,
H. A. Huggins,
期刊:
Journal of Vacuum Science&Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
(AIP Available online 1991)
卷期:
Volume 9,
issue 6
页码: 3582-3585
ISSN:1071-1023
年代: 1991
DOI:10.1116/1.585849
出版商: American Vacuum Society
关键词: LITHOGRAPHY;ALIGNMENT;ELECTRON BEAMS;BACKSCATTERING;TUNGSTEN;SILICON;FEASIBILITY STUDIES;MASKING;SIGNAL DETECTION
数据来源: AIP
摘要:
Techniques for doing alignment and registration in projection electron lithography are reviewed. The issues associated with extending these techniques to the case of high incident electron energy exposure are discussed. Measurements of backscatter electron emission contrast from W markers on Si wafers at 200 kV show that mark detection within the expected range of voltages is feasible.
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