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ENGINEERING ANALYSIS OF SOY DOUGH RHEOLOGY IN EXTRUSION

 

作者: Y. C. JAO,   A. H. CHEN,   D. LEWANDOWSKI,   W. E. IRWIN,  

 

期刊: Journal of Food Process Engineering  (WILEY Available online 1978)
卷期: Volume 2, issue 1  

页码: 97-112

 

ISSN:0145-8876

 

年代: 1978

 

DOI:10.1111/j.1745-4530.1978.tb00197.x

 

出版商: Blackwell Publishing Ltd

 

数据来源: WILEY

 

摘要:

ABSTRACTEffects of moisture level, temperature and shear rate on the rheological properties of defatted soy dough during extrusion were studied on a Brabender laboratory extruder. Entrance pressure loss through the extruder capillary die as well as viscosity of the cooked and compressed soy dough were expressed as a function of added moisture, shear rate and temperature through multiple regression analysis. Process conditions involved in this study were (a) temperature from 100 to 160°C; (b) added moisture from 22 to 32% and (c) shear rate from 50 to 10,500 sec−1. Data were collected at steady state. It was found that in the shear rate range of 50 to 1,000 sec−1and temperature range of 100 to 160°C the viscosity of the cooked and compressed soy dough with 32%, 25% and 22% added moisture ranged from 10,000 to 500 poise and 20,000 to 200 poise and 20,000 to 1,000 poise respect

 

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