ENGINEERING ANALYSIS OF SOY DOUGH RHEOLOGY IN EXTRUSION
作者:
Y. C. JAO,
A. H. CHEN,
D. LEWANDOWSKI,
W. E. IRWIN,
期刊:
Journal of Food Process Engineering
(WILEY Available online 1978)
卷期:
Volume 2,
issue 1
页码: 97-112
ISSN:0145-8876
年代: 1978
DOI:10.1111/j.1745-4530.1978.tb00197.x
出版商: Blackwell Publishing Ltd
数据来源: WILEY
摘要:
ABSTRACTEffects of moisture level, temperature and shear rate on the rheological properties of defatted soy dough during extrusion were studied on a Brabender laboratory extruder. Entrance pressure loss through the extruder capillary die as well as viscosity of the cooked and compressed soy dough were expressed as a function of added moisture, shear rate and temperature through multiple regression analysis. Process conditions involved in this study were (a) temperature from 100 to 160°C; (b) added moisture from 22 to 32% and (c) shear rate from 50 to 10,500 sec−1. Data were collected at steady state. It was found that in the shear rate range of 50 to 1,000 sec−1and temperature range of 100 to 160°C the viscosity of the cooked and compressed soy dough with 32%, 25% and 22% added moisture ranged from 10,000 to 500 poise and 20,000 to 200 poise and 20,000 to 1,000 poise respect
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