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MeV ion implantation induced damage in relaxed Si1−xGex

 

作者: A. Nylandsted Larsen,   C. O’Raifeartaigh,   R. C. Barklie,   B. Holm,   F. Priolo,   G. Franzo,   G. Lulli,   M. Bianconi,   R. Nipoti,   J. K. N. Lindner,   A. Mesli,   J. J. Grob,   F. Cristiano,   P. L. F. Hemment,  

 

期刊: Journal of Applied Physics  (AIP Available online 1997)
卷期: Volume 81, issue 5  

页码: 2208-2218

 

ISSN:0021-8979

 

年代: 1997

 

DOI:10.1063/1.364288

 

出版商: AIP

 

数据来源: AIP

 

摘要:

The damage produced by implanting, at room temperature, 3-&mgr;m-thick relaxed Si1−xGexalloys of high crystalline quality with 2 MeV Si+ions has been studied as a function of Ge content (x=0.04, 0.13, 0.24, or 0.36) and Si dose in the dose range 1010–2×1015cm−2. The accumulation of damage with increasing dose has been investigated by Rutherford backscattering spectrometry, optical reflectivity depth profiling, and transmission electron microscopy. An enhanced level of damage, and a strong decrease in the critical dose for the formation of a buried amorphous layer in Si1−xGexis observed with increasingx. Electron paramagnetic resonance studies show that the dominant defects produced by the implantation are Si and Ge dangling bonds in amorphouslike zones of structure similar toa-Si1−xGexfilms of the samex, and that the effect of increasing the ion dose is primarily to increase the volume fraction of material present in this form until a continuous amorphous layer is formed. A comparative study of the optically determined damage in the alloys with the use of a damage model indicates a significant increase in the primary production of amorphous nuclei in the alloys of Ge contentx>0.04. ©1997 American Institute of Physics.

 

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