Scanning probe microscopy studies of electromigration in electroplated Au wires
作者:
M. Paniccia,
P. Flinn,
R. Reifenberger,
期刊:
Journal of Applied Physics
(AIP Available online 1993)
卷期:
Volume 73,
issue 12
页码: 8189-8197
ISSN:0021-8979
年代: 1993
DOI:10.1063/1.353434
出版商: AIP
数据来源: AIP
摘要:
Scanning probe studies of electromigration in 4‐&mgr;m‐wide by 1‐&mgr;m‐thick electroplated Au wires reveal changes in surface morphology. Features that develop on a submicrometer length scale were observed using current densities up to 7.5×106A/cm2and temperatures up to 280 °C for time intervals ranging from a few minutes up to a few days. Scanning probe images of thesamearea taken before, during, and after current stressing reveal substantial changes in surface morphology. Both hillock growth and void formation have been observedinsitu. Changes in surface morphology caused by electromigration can be quantitatively described from the scanning probe images and new techniques for studying mass flow due to electromigration are now possible.
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