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Zero step coverage using a nozzle jet expansion deposition technique

 

作者: R. Ramanarayanan,   J. Wong,   T‐M. Lu,   D. Skelly,  

 

期刊: Journal of Vacuum Science&Technology B: Microelectronics Processing and Phenomena  （AIP Available online 1986）
卷期: Volume 4, issue 5  

页码: 1180-1181

 

ISSN:0734-211X

 

年代: 1986

 

DOI:10.1116/1.583479

 

出版商: American Vacuum Society

 

关键词: VACUUM COATING;NOZZLES;JETS;VACUUM EVAPORATION;VLSI;METALLIZATION;ALUMINIUM;Al

 

数据来源: AIP

 

摘要:

A completely nonconformal Al step coverage was observed on via structures with almost vertical sidewalls using a nozzle jet expansion deposition technique. For vias of dimensions 0.8 and 1 μ, deposition of Al by this technique resulted in a uniform layer of Al at the bottom of the vias with no sidewall coating. Possible use in several very large scale integrated (VLSI) metallization applications is suggested.

 

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