Module interconnects on flexible substrates
作者:
S. Wiedeman,
R. G. Wendt,
J. S. Britt,
期刊:
AIP Conference Proceedings
(AIP Available online 1999)
卷期:
Volume 462,
issue 1
页码: 17-22
ISSN:0094-243X
年代: 1999
DOI:10.1063/1.57949
出版商: AIP
数据来源: AIP
摘要:
Challenges posed by the fabrication of monolithic interconnects on photovoltaic (PV) modules made on a flexible, insulating substrate of polyimide are detailed. Scribing requirements and constraints using flexible substrates are compared to those existing for rigid, transparent substrates such as glass. Several approaches which can be pursued to produce low-loss module interconnects on flexible substrates are described. ©1999 American Institute of Physics.
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