The local temperature of aluminum metallization is measured directly during electromigration. High resolution thermography is used to detect void dynamics induced by a dc current. In the vicinity of the growing area, infrared radiation pulses less than 0.5 s wide are observed concomitant with resistance pulses. Their amplitudes are found to correspond to a temperature increase of more than 200 °C, which locally exceeds the melting point of aluminum metallization. These pulses occur as a consequence of void movement. Healing of voids is discussed along with the results. ©1995 American Institute of Physics.