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Materials for printed circuits and wiring

 

作者: J.T.Sweet,  

 

期刊: Proceedings of the IEE - Part B: Electronic and Communication Engineering  (IET Available online 1962)
卷期: Volume 109, issue 21S  

页码: 286-291

 

年代: 1962

 

DOI:10.1049/pi-b-2.1962.0051

 

出版商: IEE

 

数据来源: IET

 

摘要:

A brief résumé of the printed-circuit techniques in use and an outline of the preparation of the metal-clad insulating board are given. A detailed description of the types of material available is included and the performances of these materials in varying conditions are compared. Comparative costs and an outline of the fields of applications of the varying types of materials are discussed. The paper concludes with an outline of possible future trends in the production of printed-circuit materials.

 

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