Materials for printed circuits and wiring
作者:
J.T.Sweet,
期刊:
Proceedings of the IEE - Part B: Electronic and Communication Engineering
(IET Available online 1962)
卷期:
Volume 109,
issue 21S
页码: 286-291
年代: 1962
DOI:10.1049/pi-b-2.1962.0051
出版商: IEE
数据来源: IET
摘要:
A brief résumé of the printed-circuit techniques in use and an outline of the preparation of the metal-clad insulating board are given. A detailed description of the types of material available is included and the performances of these materials in varying conditions are compared. Comparative costs and an outline of the fields of applications of the varying types of materials are discussed. The paper concludes with an outline of possible future trends in the production of printed-circuit materials.
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