Low temperature fired ceramics based on alumina/glass added oxide ceramics have been developed and are being used by several companies as substrates for high density assembled modular packaging.1–3The features of low temperature fireable substrates are the cofireability with highly conductive metals such as Ag, Ag-Pd, or Cu, and the cofireability with other passive component materials for L, C, R and relatively low dielectric constant elements. But most of these substrates have the disadvantage that their thermal expansion coefficient is not perfectly compatible with Si or GaAs. This paper reports the results of a newly developed cordierite/glass based substrate employing Cu as the surface and internal conductors and having the freedom of tuning the thermal expansion coefficient by changing the composition. The ceramic composition with adjustable thermal expansion coefficient value of 3 to 7 ppm/°C can be manufactured and easily matched with the thermal expansion coefficient of Si or GaAs without a big change of electrical performance.