Substrate heater and biasing electrode assembly for rf sputtering unit
作者:
C. A. Stone,
A. Roz˘aj‐Brvar,
R. F. Davis,
期刊:
Review of Scientific Instruments
(AIP Available online 1983)
卷期:
Volume 54,
issue 5
页码: 633-635
ISSN:0034-6748
年代: 1983
DOI:10.1063/1.1137427
出版商: AIP
数据来源: AIP
摘要:
Heating and biasing of a thin film during deposition is frequently desirable to improve the structural quality of the film and to remove entrapped gases and loosely bound species on the surface. A large‐diameter electrode assembly which allows both operations to occur simultaneously with a resulting variation in film thickness across a 2.54‐cm wafer of ≤0.1 &mgr;m is described.
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