Electronic structure and thermal stability of Ni/SiC(100) interfaces
作者:
H. Höchst,
D. W. Niles,
G. W. Zajac,
T. H. Fleisch,
B. C. Johnson,
J. M. Meese,
期刊:
Journal of Vacuum Science&Technology B: Microelectronics Processing and Phenomena
(AIP Available online 1988)
卷期:
Volume 6,
issue 4
页码: 1320-1325
ISSN:0734-211X
年代: 1988
DOI:10.1116/1.584257
出版商: American Vacuum Society
关键词: STABILITY;INTERFACE PHENOMENA;SURFACE REACTIONS;NICKEL;SILICON CARBIDES;VALENCE BANDS;INTERFACE STATES;OVERLAYERS;NICKEL SILICIDES;HIGH TEMPERATURE;PHOTOEMISSION;SYNCHROTRON RADIATION;VERY HIGH TEMPERATURE;Ni;SiC
数据来源: AIP
摘要:
We have studied the interface formation of Ni overlayers on cubic SiC(100) by photoemission spectroscopy with synchrotron radiation in the energy rangehν=40–140 eV. At room temperature deposition, Ni initially reacts with SiC and forms NiSi. At a nominal coverage of ∼20 Å Ni, the overlayer is metallic and the valence band spectra are identical to that of bulk Ni. The Ni/SiC(100) system is thermally stable up to ∼600 °C. The Ni overlayer reacts with the substrate to form Ni2Si at ∼800 °C. The reacted layer is inhomogeneous and consists of a mixture of SiC and Ni2Si. The reaction of Ni with SiC is quite different than that of Ni with the (111) surface of bulk Si. Ni reacts with Si(111) at 400 °C to form an epitaxial overlayer of the more Si‐rich silicide NiSi2.
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