This paper is concerned with the optimization of the solid state diffusion bonding parameters between a nickel-base superalloy (IN 600) and a silica-containing alumina. Shear tests established the relationships between interfacial reactivity, surface roughness, residual thermal stresses and mechanical properties. The effect of cooling rate (from the bonding temperature) was considered through a limited number of experiments (compared to those investigating the influence of time and temperature of HIP bonding). The influence of bonding temperature and of cooling rates on mechanical properties can be interpreted in terms of residual stresses. These stresses also depend on the geometry of assemblies. The physico-chemical aspects at the interface were studied through the influence of time and chemistry.