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High‐precision motion and alignment in an ion‐beam proximity printing system

 

作者: D. P. Stumbo,   G. A. Damm,   S. Sen,   D. W. Engler,   F‐O. Fong,   J. C. Wolfe,   James A. Oro,  

 

期刊: Journal of Vacuum Science&Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena  （AIP Available online 1991）
卷期: Volume 9, issue 6  

页码: 3597-3600

 

ISSN:1071-1023

 

年代: 1991

 

DOI:10.1116/1.585852

 

出版商: American Vacuum Society

 

关键词: ALIGNMENT;WAFERS;ION BEAMS;FLUORESCENCE;MASKING;OPTIMIZATION;SILICA;POSITIONING;LITHOGRAPHY;ELECTRON BEAMS

 

数据来源: AIP

 

摘要:

We measure the fluorescent alignment generated by ion bombardment of an SiO2wafer mark scanned behind a corresponding window pattern in a silicon stencil mask. We conclude that an optimized system can align to 50 nm (mean+3σ) in less than 300 ms. Throughput is shown to be limited not by the alignment system, but by thermal loading of the mask during exposure.

 

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