The activation efficiencies of implanted Si, Be, and C in GaAs0.93P0.07have been measured in the annealing range 650–950 °C. Be provides much higher sheet hole densities than C, even when the latter is coimplanted with Ar to enhance the electrical activity. The maximum activation efficiency of Be is ∼60% at a dose of 5×1014cm2whereas that of C is an order of magnitude lower. Si produces donor activation percentages up to ∼20% under optimized annealing conditions. Capless proximity annealing is adequate for surface preservation up to ∼950 °C, as measured by scanning electron microscopy and atomic force microscopy. Photoluminescence measurements provide evidence that nonradiative, damage‐related point defects remain in the GaAsP even after annealing of 950 °C. ©1996 American Institute of Physics.