Reduction of secondary defect formation in MeV B+ion‐implanted Si (100)
作者:
W. X. Lu,
Y. H. Qian,
R. H. Tian,
Z. L. Wang,
R. J. Schreutelkamp,
J. R. Liefting,
F. W. Saris,
期刊:
Applied Physics Letters
(AIP Available online 1989)
卷期:
Volume 55,
issue 18
页码: 1838-1840
ISSN:0003-6951
年代: 1989
DOI:10.1063/1.102181
出版商: AIP
数据来源: AIP
摘要:
MeV ion implantation in Si above a dose of 1014/cm2leads to secondary defect formation in a buried layer, which is rather stable. Annealing of Si(100) implanted with 2.0 MeV B+ions to a dose of 2.2×1014/cm2has been investigated by means of cross‐sectional transmission electron microscopy. After annealing at 900 °C for 15 min, dislocation loops elongated along [110] were found. A remarkable decrease in secondary defect formation has been observed if, in addition, 140 keV Si+was implanted prior to annealing.
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