Two‐dimensional modeling of high plasma density inductively coupled sources for materials processing
作者:
Peter L. G. Ventzek,
Robert J. Hoekstra,
Mark J. Kushner,
期刊:
Journal of Vacuum Science&Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
(AIP Available online 1994)
卷期:
Volume 12,
issue 1
页码: 461-477
ISSN:1071-1023
年代: 1994
DOI:10.1116/1.587101
出版商: American Vacuum Society
关键词: HIGH−FREQUENCY DISCHARGES;PLASMA POTENTIAL;PLASMA DENSITY;TWO−DIMENSIONAL CALCULATIONS;ETCHING;USES;ARGON;OXYGEN;CARBON TETRAFLUORIDE;MATHEMATICAL MODELS
数据来源: AIP
摘要:
Inductively coupled plasma sources are being developed to address the need for high plasma density (1011–1012cm−3), low pressure (a few to 10–20 mTorr) etching of semiconductor materials. One such device uses a flat spiral coil of rectangular cross section to generate radio‐frequency (rf) electric fields in a cylindrical plasma chamber, and capacitive rf biasing on the substrate to independently control ion energies incident on the wafer. To investigate these devices we have developed a two‐dimensional hybrid model consisting of electromagnetic, electron Monte Carlo, and hydrodynamic modules; and an off line plasma chemistry Monte Carlo simulation. The results from the model for plasma densities, plasma potentials, and ion fluxes for Ar, O2, Ar/CF4/O2gas mixtures will be presented.
点击下载:
PDF
(1493KB)
返 回