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High-Temperature Insulating Adhesives for Vacuum Applications

 

作者: B. R. F. Kendall,   M. F. Zabielski,  

 

期刊: Journal of Vacuum Science and Technology  (AIP Available online 1966)
卷期: Volume 3, issue 3  

页码: 114-119

 

ISSN:0022-5355

 

年代: 1966

 

DOI:10.1116/1.1492463

 

出版商: American Vacuum Society

 

数据来源: AIP

 

摘要:

Results of experiments with several types of adhesives that withstand bakeout temperatures of 300 °C in vacuum are given. The experiments included measurements of outgassing rates, mass spectra of evolved gases, and electrical and mechanical properties. Certain polyimide and silicone resins were found to have outgassing rates below10−7Torr litersec−1 cm−2at temperatures up to 155 °C. With the addition of trace amounts of uniform small glass spheres to obtain reproducible electrical characteristics, some of these materials also exhibited good insulating and bonding properties when used to join metal surfaces. Possible applications in the construction of experimental electron devices and other high-vacuum apparatus are discussed.

 

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