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Quantitative measurement of the stress transfer function in nickel/polyimide thin film/copper thin film structures

 

作者: L. Schadler,   I. C. Noyan,  

 

期刊: Applied Physics Letters  (AIP Available online 1995)
卷期: Volume 66, issue 1  

页码: 22-24

 

ISSN:0003-6951

 

年代: 1995

 

DOI:10.1063/1.114168

 

出版商: AIP

 

数据来源: AIP

 

摘要:

The stress transfer behavior in multilayer thin film structures (nickel/polyimide/copper) was measured using x‐ray stress analysis. Copper was deposited in various line lengths, and the stress/strain transferred from a loaded Ni substrate to the Cu thin film was measured as a function of line length. It was found that there is incomplete strain transfer from one layer to another, and that the shape of the stress transfer function is similar to that predicted by the shear lag model. ©1995 American Institute of Physics.

 

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