Classification of etching mechanism in reactive ion beam etch
作者:
Takashi Tadokoro,
Fumio Koyama,
Kenichi Iga,
期刊:
Journal of Vacuum Science&Technology B: Microelectronics Processing and Phenomena
(AIP Available online 1989)
卷期:
Volume 7,
issue 5
页码: 1111-1114
ISSN:0734-211X
年代: 1989
DOI:10.1116/1.584560
出版商: American Vacuum Society
关键词: ETCHING;ION BEAMS;CHEMICAL REACTIONS;GALLIUM ARSENIDES;INDIUM PHOSPHIDES;ULTRAHIGH VACUUM;CLASSIFICATION;ION SOURCES;CHLORINE;PHOTOIONIZATION;MICROWAVE RADIATION;SURFACE PROPERTIES;TEMPERATURE DEPENDENCE;BEAM EXTRACTION;CHLORINE IONS;InP;GaAs
数据来源: AIP
摘要:
Etching characteristics for GaAs and InP using an ultrahigh vacuum reactive ion beam etching (UHV‐RIBE) system have been classified. Using a horizontal electron cyclotron resonance (ECR) ion source, a uniform ion beam covering a large area is obtained, and etching at low pressure (≂10−5Torr) has become possible. The etching gas Cl2, is ionized at a gas pressure of 6×10−4Torr, and typical applied microwave power is 300 W. We have classified the etching behavior into three categories as a function of extraction voltage and tried to clarify the change of the edge profile and surface condition. It is possible to obtain a vertical mesa. The maximum etch rates for InP and GaAs are 2.0 μm/min and 1.2 μm/min at high temperature and high applied voltage. Under appropriate conditions almost comparable etch rates for GaAs and InP have been obtained.
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