Bicrystal metal films were prepared by electrodeposition of nickel on evaporated, single‐crystal copper films. Electron microscopic examination of the bicrystal films revealed interfacial dislocations which aid in reducing the misfit strain between the crystals. In both (100) and (111) bicrystals, misfit dislocations, aligned in <110> directions, were observed with Burgers vectors not contained in the interfacial plane. Glide of pre‐existing or surface nucleated dislocations is suggested as the method by which this type of misfit dislocation is produced.