首页   按字顺浏览 期刊浏览 卷期浏览 Submicron pattern dimension determination using a total waveform comparison method
Submicron pattern dimension determination using a total waveform comparison method

 

作者: Shinya Hasegawa,   Yasuo Iida,   Toshiharu Hidaka,  

 

期刊: Journal of Vacuum Science&Technology B: Microelectronics Processing and Phenomena  (AIP Available online 1988)
卷期: Volume 6, issue 3  

页码: 866-870

 

ISSN:0734-211X

 

年代: 1988

 

DOI:10.1116/1.584312

 

出版商: American Vacuum Society

 

关键词: VLSI;LITHOGRAPHY;THICKNESS;LINE WIDTHS;RESOLUTION;MONTE CARLO METHOD;SCANNING ELECTRON MICROSCOPY;FABRICATION

 

数据来源: AIP

 

摘要:

A pattern dimension determination method has been developed. The three parameters, linewidth, wall angle, and film thickness represent pattern dimension. The total waveform of a measured backscattered electron signal is compared with a standard signal data base. Two methods are adopted to reduce data base construction time. (1) The data base was constructed with Monte Carlo simulation by a supercomputer. (2) Data base size is reduced using a waveform approximation method. The two improvements result in fast data base construction (26 min) for a specified material sample. This data base construction method is more practical than preparing signal data base from real standard sample due to data base construction time. Obtained dimensional accuracies are found to be 0.02 μm, 5 deg, and 0.1 μm for linewidth, wall angle, and film thickness, respectively, with scanning electron micrograph comparisons. Deduction time for obtaining physical dimensions from a signal was 17 s.

 

点击下载:  PDF (450KB)



返 回