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Low resistance Ohmic contact scheme (∼&mgr;&OHgr;cm2) top-InP

 

作者: Moon-Ho Park,   L. C. Wang,   J. Y. Cheng,   C. J. Palmstro&slash;m,  

 

期刊: Applied Physics Letters  (AIP Available online 1997)
卷期: Volume 70, issue 1  

页码: 99-101

 

ISSN:0003-6951

 

年代: 1997

 

DOI:10.1063/1.119320

 

出版商: AIP

 

数据来源: AIP

 

摘要:

A low resistance Pd/Sb/Zn/Pd Ohmic contact based on the solid phase regrowth principle has been investigated top-InP. Contact resistivity as low as∼2×10−6 &OHgr; cm2has been obtained for samples annealed at 500 °C for 1 min. The Ohmic behavior can be rationalized by the formation of a heavily doped surface layer or a heterojunction. The InSb phase responsible for the observed low resistivity is identified using the x-ray diffraction technique. ©1997 American Institute of Physics.

 

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