Damage behavior of silicon by MeV Ge+irradiation under tilted angle
作者:
Ke‐Ming Wang,
Bo‐Rong Shi,
Shi‐Jie Ma,
Xiang‐Dong Liu,
Hong‐Ying Zhai,
Tian‐Bin Xu,
Pei‐Ran Zhu,
Qing‐Tai Zhao,
期刊:
Journal of Vacuum Science&Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
(AIP Available online 1994)
卷期:
Volume 12,
issue 5
页码: 3027-3030
ISSN:1071-1023
年代: 1994
DOI:10.1116/1.587554
出版商: American Vacuum Society
关键词: SILICON;ION IMPLANTATION;PHYSICAL RADIATION EFFECTS;GERMANIUM IONS;MEV RANGE 01−10;INCIDENCE ANGLE;COMPUTERIZED SIMULATION;MULTIPLE SCATTERING;DEPTH PROFILES;Si
数据来源: AIP
摘要:
The damage behavior of Si induced by MeV Ge+under tilted angle has been studied. In order to investigate the effect of implanted energy and angle on the damage distribution, the energies were varied from 1 to 2 MeV and the angles were varied from 7° to 60°. The experimental damage distribution is extracted based on the procedure by Feldman and Rodgers [L. E. Feldman and J. W. Rodgers, J. Appl. Phys.41, 3776 (1970)] using the multiple‐scattering model. The experimental data obtained are compared with the TRIM’90 code. The results show that the lateral damage spread can not be neglected; the shape and the depth of damage distribution are well described by the TRIM’90 code under tilted angle irradiation for Si(100).
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