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Damage behavior of silicon by MeV Ge+irradiation under tilted angle

 

作者: Ke‐Ming Wang,   Bo‐Rong Shi,   Shi‐Jie Ma,   Xiang‐Dong Liu,   Hong‐Ying Zhai,   Tian‐Bin Xu,   Pei‐Ran Zhu,   Qing‐Tai Zhao,  

 

期刊: Journal of Vacuum Science&Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena  (AIP Available online 1994)
卷期: Volume 12, issue 5  

页码: 3027-3030

 

ISSN:1071-1023

 

年代: 1994

 

DOI:10.1116/1.587554

 

出版商: American Vacuum Society

 

关键词: SILICON;ION IMPLANTATION;PHYSICAL RADIATION EFFECTS;GERMANIUM IONS;MEV RANGE 01−10;INCIDENCE ANGLE;COMPUTERIZED SIMULATION;MULTIPLE SCATTERING;DEPTH PROFILES;Si

 

数据来源: AIP

 

摘要:

The damage behavior of Si induced by MeV Ge+under tilted angle has been studied. In order to investigate the effect of implanted energy and angle on the damage distribution, the energies were varied from 1 to 2 MeV and the angles were varied from 7° to 60°. The experimental damage distribution is extracted based on the procedure by Feldman and Rodgers [L. E. Feldman and J. W. Rodgers, J. Appl. Phys.41, 3776 (1970)] using the multiple‐scattering model. The experimental data obtained are compared with the TRIM’90 code. The results show that the lateral damage spread can not be neglected; the shape and the depth of damage distribution are well described by the TRIM’90 code under tilted angle irradiation for Si(100).

 

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