Explosive recrystallization during pulsed laser irradiation
作者:
J. Narayan,
S. J. Pennycook,
D. Fathy,
O. W. Holland,
期刊:
Journal of Vacuum Science&Technology A: Vacuum, Surfaces, and Films
(AIP Available online 1984)
卷期:
Volume 2,
issue 4
页码: 1495-1497
ISSN:0734-2101
年代: 1984
DOI:10.1116/1.572390
出版商: American Vacuum Society
关键词: RECRYSTALLIZATION;SILICON;PHOTON COLLISIONS;MICROSTRUCTURE;ELECTRON MICROSCOPY;BACKSCATTERING;LIQUIDS;THIN FILMS;SEGREGATION;COPPER;ATOM TRANSPORT;ION IMPLANTATION;COPPER IONS;SILICON IONS;LAYERS;IMPURITIES;Si
数据来源: AIP
摘要:
The phenomenon of explosive recrystallization has been studied in Si+and Cu+implanted amorphous silicon layers by electron microscopy and Rutherford backscattering techniques (RBS). Cross‐section and plan‐view electron microscopy techniques (TEM) have been used to obtain a detailed characterization of microstructures associated with the explosive mode of recrystallization. RBS and analytical TEM studies on segregation of copper provided information on the mechanism of explosive recrystallization involving a thin liquid film interposed between crystallized and uncrystallized regions.
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