Defect production in copper and silver by light energetic ions
作者:
R. S. Averback,
R. Benedek,
K. L. Merkle,
期刊:
Applied Physics Letters
(AIP Available online 1977)
卷期:
Volume 30,
issue 9
页码: 455-457
ISSN:0003-6951
年代: 1977
DOI:10.1063/1.89449
出版商: AIP
数据来源: AIP
摘要:
Measurements have been made of the change in residual electrical resistivity in thin‐film specimens of Cu and Ag induced by light‐ion irradiations (H,D,3He,4He) below 10 K in the energy range 15–40 keV. The number of Frenkel pairs created per incident ion was deduced and compared with theoretical predictions. The efficiency factor (ratio of experimental to theoretical value) was found to decrease from ∼1 to 0.7 (0.9 to 0.65) for Cu (Ag) as the recoil spectrum was shifted to higher energies by increasing the projectile mass and/or energy.
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