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Defect production in copper and silver by light energetic ions

 

作者: R. S. Averback,   R. Benedek,   K. L. Merkle,  

 

期刊: Applied Physics Letters  (AIP Available online 1977)
卷期: Volume 30, issue 9  

页码: 455-457

 

ISSN:0003-6951

 

年代: 1977

 

DOI:10.1063/1.89449

 

出版商: AIP

 

数据来源: AIP

 

摘要:

Measurements have been made of the change in residual electrical resistivity in thin‐film specimens of Cu and Ag induced by light‐ion irradiations (H,D,3He,4He) below 10 K in the energy range 15–40 keV. The number of Frenkel pairs created per incident ion was deduced and compared with theoretical predictions. The efficiency factor (ratio of experimental to theoretical value) was found to decrease from ∼1 to 0.7 (0.9 to 0.65) for Cu (Ag) as the recoil spectrum was shifted to higher energies by increasing the projectile mass and/or energy.

 

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